Electronic module assembly

Author:

Franke JörgORCID,Wang LihuiORCID,Bock Karlheinz,Wilde Jürgen

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Mechanical Engineering

Reference229 articles.

1. Placement and routing in 3D integrated circuits;Ababei;IEEE Des Test Comput,2005

2. CFD Modeling of Pin Shape Effects on Capillary Flow During Wave Soldering;Abdul Aziz;Int J Heat Mass Transfer,2014

3. AEC Automotive Electronics Council (2011) Stress-Test-Driven Qualification of Integrated Circuits(AEC - Q100).

4. Quality investigation of miniaturized moulded interconnect devices (MIDs) for hearing aid applications;Islam;CIRP Ann,2015

5. High speed nozzle jet printing for bendable organic light emitting diodes;An;Flexible Printed Electron,2019

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