Process development for the assembly of microsystems with hot melt adhesives-Reference-Cited by-同舟云学术

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Process development for the assembly of microsystems with hot melt adhesives

Published:2012 Issue:1 Volume:61 Page:5-8
ISSN:0007-8506
Container-title:CIRP Annals
language:en
Short-container-title:CIRP Annals

Author:

Raatz Annika,Rathmann Sven,Hesselbach Jürgen

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Mechanical Engineering

Reference10 articles.

1. Assembly of Microsystems;Brussel Hv Peirs;CIRP Annals – Manufacturing Technology,2000

2. Micro Engineering;Alting;CIRP Annals – Manufacturing Technology,2003

3. Montage hybrider Mikrosysteme: Handhabungs- und Fügetechniken für die Klein- und Mittelserienfertigung,2005

4. Kleben: Grundlagen, Technologien, Anwendungen 5;Habenicht,2006

5. Use of Hot Melt Adhesives for the Assembly of Microsystems;Hemken,2011

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Characterization a polyurethane-based reactive hot melt adhesive for applications in materials;DYNA;2019-07-01

2. State of the Art Robotic Grippers and Applications;Robotics;2016-06-17

3. Grasping devices and methods in automated production processes;CIRP Annals;2014

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