A new strategy to reduce edge chipping using stress wave impedance matching
Author:
Publisher
Elsevier BV
Subject
Industrial and Manufacturing Engineering,Mechanical Engineering
Reference11 articles.
1. Stress Waves in Solids;Kolsky,1953
2. Material embrittlement in high strain-rate loading;Yang;Int. J. Extreme Manuf.,2019
3. Edge chipping of silicon wafers in diamond grinding;Gao;Int. J. Mach. Tools Manuf,2013
4. Study on grinding force modelling and ductile regime propelling technology in micro drill-grinding of hard-brittle materials;Cheng;J. Mater. Process. Technol.,2015
5. On the mechanism of edge chipping reduction in rotary ultrasonic drilling: a novel experimental method;Wang;Precision Eng.,2016
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