Effect of input power and interfacial powder size on microwave joining of different materials: A review
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Published:2021
Issue:
Volume:46
Page:194-197
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ISSN:2214-7853
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Container-title:Materials Today: Proceedings
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language:en
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Short-container-title:Materials Today: Proceedings
Author:
Kamble Devendra L,
Kumar Sahu Ranjeet,
Narendranath S.,
Badiger R.I.ORCID
Reference37 articles.
1. Microwave processing: fundamentals and applications;Thostenson;Compos. A,1999
2. Microwave processing of materials;Clark;Annu. Rev. Mater. Sci.,1996
3. Microwave material processing-a review;Chandrasekaran;AIChE J.,2012
4. M.Gupta, E.W.W. Leong, W.L. Wong, Microwaves and metals, John Wiley & Sons (Asia), 2007.
5. Microwave-material interaction phenomena: Heating mechanisms, challenges and opportunities in material processing;Mishra;Composite. Part A,2016
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