Thin film to nano copper deposition by special additives on an ecofriendly electroless bath

Author:

Balaramesh P.,Jayalakshmi S.,Absara Fdo S.,Anitha V.,Venkatesh P.

Publisher

Elsevier BV

Subject

General Medicine

Reference26 articles.

1. Nickel plating on steel by chemical reduction;Brenner;J. Res. Natl. Bur.,1946

2. Effects of K4Fe(CN)6 on electroless copper plating using hypophosphite as reducing agent’;Gan;J. Appl. Electrochem.,2007

3. Accelerating effect of ammonia on electroless copper deposition in alkaline formaldehyde-containing solutions;Vaškelis;J. Electroanal. Chem.,2007

4. Kinetics of electroless copper plating I: Empirical rate law;Shippey;Plating,1973

5. The inhibitive effect of vitamin-C on the corrosive performance of steel in HCl solutions;Fuchs-Godec;Int. J. Electrochem. Sci.,2013

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