Electrochemical behaviour of lead-free Sn-In-Al solders alloys in 3.5 wt.% NaCl solution-Reference-Cited by-同舟云学术

Electrochemical behaviour of lead-free Sn-In-Al solders alloys in 3.5 wt.% NaCl solution

Published:2022 Issue: Volume:57 Page:187-193
ISSN:2214-7853
Container-title:Materials Today: Proceedings
language:en
Short-container-title:Materials Today: Proceedings

Author:

Jaiswal Dheeraj,Pathote Dileep,Singh Vikrant,Behera C.K.

Publisher

Elsevier BV

Subject

General Medicine

Reference18 articles.

1. Intermetallic growth study at Sn–3.0Ag–0.5Cu/Cu solder joint interface during different thermal conditions;Li;J. Mater. Sci.: Mater. Electron.,2015

2. Wettability and interfacial morphology of Sn–3.0Ag–0.5Cu solder on electroless nickel plated ZnS transparent ceramic;Zhang;J Mater Sci Mater Electron [Internet],2019

3. Property alterations of Sn-0.6Cu-0.05Ni-Ge lead-free solder by Ag, Bi, In and Sb addition;Kanlayasiri;Trans. Nonferrous Met. Soc. China (English Ed.),2018

4. A review of mechanical properties of lead-free solders for electronic packaging;Ma;J. Mater. Sci.,2009

5. Corrosion resistance of Pb-free and novel nano-composite solders in electronic packaging;Tsao,2012

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