Atomistic insights to study the effects of nano-voids on shock compression behaviour of single crystal and bicrystal nickel
Author:
Publisher
Elsevier BV
Subject
Materials Science (miscellaneous)
Reference54 articles.
1. Mechanical behaviors and molecular deformation mechanisms of polymers under high speed shock compression: A molecular dynamics simulation study;Xie;Polymer (Guildf).,2016
2. Role of nanoscale Cu/Ta interfaces on the shock compression and spall failure of nanocrystalline Cu/Ta systems at the atomic scales;Chen;J. Mater. Sci.,2018
3. Dynamic mechanical behaviors of calcium silicate hydrate under shock compression loading using molecular dynamics simulation;Lin;J. Non. Cryst. Solids,2018
4. Orientation-dependent responses of tungsten single crystal under shock compression via molecular dynamics simulations;Liu;Comput. Mater. Sci.,2015
5. Molecular dynamics studies on energy dissipation and void collapse in graded nanoporous nickel under shock compression;Liao;Mech. Mater.,2018
Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Temperature-dependent void nucleation and growth in single-crystal and nanocrystalline iron at extreme strain rates: atomistic insights;Journal of Physics: Conference Series;2024-02-01
2. Molecular Dynamics Study on Tensile Strength of Ni-10Cu Alloy with Pre-existing Σ3 Grain Boundary;Lecture Notes in Mechanical Engineering;2024
3. Effect of Frenkel pairs on the tensile and shock compression strength of multi-elemental alloys;Physica Scripta;2023-08-21
4. An atomistic approach to characterize the shock response in BNNS reinforced polyethylene nanocomposites;Materials Today: Proceedings;2023
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3