Author:
Seifert Tobias,Baum Mario,Roscher Frank,Wiemer Maik,Gessner Thomas
Reference18 articles.
1. “SOP: What Is It and Why?. A New Microsystem-Integration Technology Paradigm-Moore's Law for System Integration of Miniaturized Convergent Systems of the Next Decade”;Tummala;IEEE Trans. Adv. Packag,2004
2. Direct writing technology - Advances and developments;Hon;CIRP Annals - Manufacturing Technology,2008
3. System-on-Chip: Reuse and Integration;Saleh;Proc. IEEE,2006
4. Chang I., Tsai J., Chiang J., Liu D., Tsai F. L., Shih D. and Tung E., “Development for VCI (Vertical Circuit Interconnection) technology for stacked die package”, in Electronics Packaging Technology Conference (EPTC), 2011, pp. 333-335 7-9 Dec. 2011.
5. Inkjet printed dielectrics for electronic packaging of chip embedding modules;Mengel;Microelectronic Engineering,2010
Cited by
38 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献