1. Design and Evaluation of multiple valued logic gates using psedo N-Type carbon nanotube FETs;Liang;IEEE Trans. Nanotech.,2014
2. A hardware-friendly arithemetic method and effcient implementations for designing dital fuzzy adders;Navi;Fuzzy Sets Syst.,2011
3. Electromagnetic modeling of through-silicon via (TSV) interconnections using cylindrical modal basis functions;Han;IEEE Trans. Ad. Pack,2010
4. B. Xie, K. J. Han, M. Swaminathan, J. Xie, Coupling analysis of through-silicon via (TSV) arrays in silicon interposers for 3D systems, in: Proce. IEEE Int. Sym. Electromag. Compat., 2011, pp. 16–21.
5. W.X. Chang, O.Z. Zaw, L. En-Xiao, L. Er-Ping, Power integrity analysis of TSV based 3-D integrated circuits, in: Proce. Int. Conf. Micro. Millim. Wave Technol. (ICMMT), 2012, pp. 1–4.