Thermal, electrical, and mechanical properties of highly filled HDPE/graphite nanoplatelets composites
Author:
Funder
Qatar National Research Fund
Publisher
Elsevier BV
Subject
General Medicine
Reference23 articles.
1. Rheology, Morphology, and Thermal Behavior of HDPE/Clay Nanocomposites;Rezanavaz;Polym. Compos.,2010
2. Mechanical and rheological properties of HDPE/graphite composite with enhanced thermal conductivity;Wang;Polym. Compos.,2001
3. Characterization of Rheological and Thermophysical Properties of HDPE- Wood Composite;Tazi;J. Appl. Polym. Sci.,2014
4. A Convenient Route to High-Performance HDPE-CNT Conductive Nanocomposites by Control of Matrix Nucleation;Tao;Macromol. Chem. Phys.,2012
5. Preparation of a HDPE/Carbon Nanotube Composite;Yu;Polym. Plast. Technol. Eng.,2010
Cited by 26 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Effect of synthesized copper oxide nanorods on electrical and thermal properties of compatibilized high‐density polyethylene/carbon nanofiber nanocomposite films;Polymer Composites;2024-07-03
2. The Effect of Silanized Halloysite Nanotubes on the Structure of Polyethylene–Based Composite;Materials;2024-07-02
3. Comparative morphological, thermal, and mechanical characteristics of doped bentonite and dolomite natural clay fillers into high‐density polyethylene;Journal of Applied Polymer Science;2024-06-27
4. High temperature co-polyester thermoplastic elastomer nanocomposites for flexible self-regulating heating devices;Materials & Design;2024-06
5. Enhancing HDPE Properties: Impact of Nano-TiO2 and Nano-SiO2 Particles on Mechanical Properties and Wear Resistance;Journal of The Institution of Engineers (India): Series D;2024-05-19
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3