Signal integrity analysis of bundled carbon nanotubes as futuristic on-chip interconnects-Reference-Cited by-同舟云学术

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Signal integrity analysis of bundled carbon nanotubes as futuristic on-chip interconnects

Published:2021 Issue: Volume:43 Page:3874-3879
ISSN:2214-7853
Container-title:Materials Today: Proceedings
language:en
Short-container-title:Materials Today: Proceedings

Author:

Pathade Takshashila,Agrawal Yash,Parekh Rutu,Palaparthy Vinay

Publisher

Elsevier BV

Subject

General Medicine

Reference10 articles.

1. International Technology Roadmap for Semiconductors (ITRS), 2005 and 2015, available online: http://www.itrs.net/.

2. Analysis of Delay and Dynamic Crosstalk in Bundled Carbon Nanotube Interconnects

3. Towards realisation of mixed carbon nanotube bundles as VLSI interconnects: A review

4. T. Pathade, Y. Agrawal, R. Parekh, G. Mekala, Spr. Book Chapter – in press.

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effective Low Power ALU Design with Incorporation of MWCNTB On-chip Interconnects;2022 IEEE 24th Electronics Packaging Technology Conference (EPTC);2022-12-07

2. An Energy-Efficient Crosstalk Reduction Strategy for On-Chip Buses Using Carbon-Based Transistors and Interconnects;ECS Journal of Solid State Science and Technology;2021-05-01

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