Analysis of transport phenomena governing interfacial bonding and void dynamics during thermoplastic tow-placement

Author:

Pitchumani R.,Ranganathan S.,Don R.C.,Gillespie J.W.,Lamontia M.A.

Publisher

Elsevier BV

Subject

Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics

Reference23 articles.

1. Design, manufacture and testing of AS-4 graphite/PEEK thermoplastic composite 24-inch ring-stiffened cylinder model;Lamontia,1992

2. Performance of a filament wound graphite thermoplastic composite ring-stiffened pressure hull model;Lamontia;J. Thermoplastic Compos. Mater.,1995

3. Thermal analysis of in-situ thermoplastic composite tape laying;Nejhad;J. Thermoplastic Compos. Mater.,1991

4. Thermal analysis of laser assisted thermoplastic matrix composite tape consolidation;Beyeler;J. Heat Transfer,1988

5. Thermal modeling of tape laying with continuous carbon fiber reinforced thermoplastic;Grove;Composites,1988

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