Genetic algorithms for thermosciences research: application to the optimized cooling of electronic components-Reference-Cited by-同舟云学术

Genetic algorithms for thermosciences research: application to the optimized cooling of electronic components

Published:1994-04 Issue:6 Volume:37 Page:893-908
ISSN:0017-9310
Container-title:International Journal of Heat and Mass Transfer
language:en
Short-container-title:International Journal of Heat and Mass Transfer

Author:

Queipo N.,Devarakonda R.,Humphrey J.A.C.

Publisher

Elsevier BV

Subject

Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics

Reference22 articles.

1. Interactive computational-experimental methodologies (ICEME) for thcrmofluids research: Application to the optimized packaging of heated electronic components;Humphrey,1993

2. Modeling air flow in electronic packages;Weiss;Mech. Engng,1989

3. Sensitivity of circuit pack thermal performance to convective and geometric variation;Azar;IEEE Trans. Components, Hybrids Manufact. Technol.,1989

4. Iterative Methods for Non-linear Optimization Problems;Jacoby,1972

5. A search technique for multimodal surfaces;Hill;IEEE Trans. Systems, Sci. Cybernetics,1969

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