1. High heat from a small package;Oktay;Mech. Engng,1986
2. Cooling electronic equipment by direct evaporation of liquid refrigerant;Greene;Air Material Command Rept PB 136065,1948
3. Two phase liquid cooling;Bergles,1986
4. Wall superheat excursions in the boiling incipience of dielectric fluids;Bar-Cohen;Heat Transfer Engng,1988
5. Supercomputers demand innovation in packing and cooling;Lyman;Electronics,1982