A fracture model for assessing tensile mode crack growth resistance of rocks
Author:
Publisher
Elsevier BV
Subject
Geotechnical Engineering and Engineering Geology
Reference60 articles.
1. Size-dependent fracture behavior of Guiting limestone under mixed mode loading;Akbardoost;Int. J. Rock Mech. Min. Sci.,2014
2. Geometry effects and statistical analysis of mode I fracture in Guiting limestone;Aliha;Int. J. Rock Mech. Min. Sci.,2012
3. Sub-sized short bend beam configuration for the study of mixed-mode fracture;Aliha;Eng. Fract. Mech.,2020
4. A novel test device for the direct measurement of tensile strength of rock using ring shape sample;Aliha;Int. J. Rock Mech. Min. Sci.,2021
5. On the use of different diametral compression cracked disc shape specimens for introducing mode III deformation;Aliha;Fatig. Fract. Eng. Mater. Struct.,2021
Cited by 25 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Damaged creep constitutive models of rock-like materials containing multiple flaws and their relationships to those of the intact materials;Theoretical and Applied Fracture Mechanics;2024-04
2. Predicting the Critical Grout Pressure in Anisotropic Rocks Based on the Maximum Energy Release Rate Criterion;International Journal of Geomechanics;2024-02
3. Influence of distinct testing methods on the mode-I fracture toughness of Longmaxi shale;Theoretical and Applied Fracture Mechanics;2024-02
4. Study on the size effect of rock under dynamic direct tension and indirect tension;Environmental Earth Sciences;2023-12-18
5. Fracture process zone of mode I in compacted clay through digital image correlation;Theoretical and Applied Fracture Mechanics;2023-12
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3