An improved 2D model for bonded composite joints
Author:
Publisher
Elsevier BV
Subject
Polymers and Plastics,General Chemical Engineering,Biomaterials
Reference75 articles.
1. A review of the strength of joints in fibre reinforced plastics Part 2;Matthews;Composites,1982
2. Non-linear finite element analysis of joints adhesively bonding composite materials;Remy,1991
3. Adams RD, Wake WC. The nature and magnitude of stresses in adhesive joints. Structural adhesive joints in engineering. Amsterdam: Elsevier Applied Science Publishers; 1984. p. 14–114 [chapter 2].
4. Clarke JD, Mcgregor IJ. Ultimate tensile stress over a zone: a new failure criterion for adhesive joints. J Adhes 1993;42.
5. Stress field sensitivity of a composite patch repair as a result of varying patch repair thickness. ASTM STP 1120;Siener;Compos Mater: Testing Des,1992
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