Thermal residual stress analysis of epoxy bi-material laminates and bonded joints
Author:
Publisher
Elsevier BV
Subject
Polymers and Plastics,General Chemical Engineering,Biomaterials
Reference38 articles.
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2. Effect of thermal residual stresses on the crack path adhesively bonded joints;Daghhiyani;J Mater Sci,1996
3. Steady-state thermal and geometrically non-linear stress analysis of an adhesively bonded tee joint with double support;Kemal Apalak;Int J Adhes Adhes,2003
4. Geometrically non-linear thermal stress analysis of an adhesively bonded tubular single lap joint;Kemal Apalak;Finite Elem Anal Des,2003
5. Joint strength predictions for adhesive joints to be used over a wide temperature range.;da Silva;Int J Adhes Adhes,2007
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