Acceleration of the curing process of a paste adhesive for aerospace applications considering cure dependent void formations-Reference-Cited by-同舟云学术

Acceleration of the curing process of a paste adhesive for aerospace applications considering cure dependent void formations

Published:2014-01 Issue: Volume:48 Page:51-58
ISSN:0143-7496
Container-title:International Journal of Adhesion and Adhesives
language:en
Short-container-title:International Journal of Adhesion and Adhesives

Author:

Sánchez Cebrián A.,Basler R.,Klunker F.,Zogg M.

Publisher

Elsevier BV

Subject

Polymers and Plastics,General Chemical Engineering,Biomaterials

Reference24 articles.

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2. Methodology for optimization of the curing cycle of paste adhesives;Sánchez Cebrián;International Journal of Adhesion and Adhesives,2013

3. Modelling anomalous moisture uptake, swelling and thermal characteristics of a rubber toughened epoxy adhesive;Loh;International Journal of Adhesion and Adhesives,2005

4. The effect of composite prebond moisture on adhesive-bonded CFRP-CFRP joints;Parker;Composites,1983

5. The electronic packaging handbook;Blackwell,2000

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