Three dimensional finite element analysis of bi-adhesively bonded double lap joint
Author:
Publisher
Elsevier BV
Subject
Polymers and Plastics,General Chemical Engineering,Biomaterials
Reference19 articles.
1. Performance of bi-adhesive bonded aluminium lap joints;Pires;Int J Adhes Adhes,2003
2. Variable modulus adhesives: an approach to optimized joint performance;Fitton;Int J Adhes Adhes,2005
3. Three-dimensional finite element analysis of the stress distribution in bi-adhesive bonded joints;Kong;J Adhes,2008
4. Analysis of tubular adhesive joints with a functionally modulus graded bondline subjected to axial loads;Kumar;Int J Adhes Adhes,2009
5. Joint strength optimization by the mixed-adhesive technique;da Silva;Int J Adhes Adhes,2009
Cited by 50 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Optimization of adherend thickness and overlap length on failure load of bonded 3D printed PETG parts using response surface method;Rapid Prototyping Journal;2024-07-19
2. Damage Recognition of Acoustic Emission and Micro-CT Characterization of Bi-adhesive Repaired Composites Based on the Machine Learning Method;Applied Composite Materials;2024-01-31
3. Viscoelastic model to evaluate the shear and peel stresses in the two-adhesive bonded lap joints;Journal of Adhesion Science and Technology;2023-09-26
4. A numerical study on stress mitigation in through-thickness tailored bi-adhesive single-lap joints;Journal of Adhesion Science and Technology;2023-06-13
5. An investigation on the mechanical behavior of mixed adhesively bonded composite joints subjected to transverse pre-impact following by axial post-tensile;Materials Today Communications;2023-06
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3