Determination of failure envelope of functionally graded adhesive bonded joints by using mixed mode continuum damage model and response surface method-Reference-Cited by-同舟云学术

Determination of failure envelope of functionally graded adhesive bonded joints by using mixed mode continuum damage model and response surface method

Published:2021-04 Issue: Volume:106 Page:102815
ISSN:0143-7496
Container-title:International Journal of Adhesion and Adhesives
language:en
Short-container-title:International Journal of Adhesion and Adhesives

Author:

Kim Myong-Ho,Hong Hyon-Sik,Kim Yong-Chol

Publisher

Elsevier BV

Subject

Polymers and Plastics,General Chemical Engineering,Biomaterials

Reference32 articles.

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4. Adhesively bonded joints in composite materials: an overview;Banea;Part L: J Mat Design App,2009

5. A review of finite element analysis of adhesively bonded joints;Xiaocong;Int J Adhesion Adhes,2011

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