Mode II interlaminar fracture toughness of woven E-glass/epoxy composites in the presence of mat interleaves
Author:
Publisher
Elsevier BV
Subject
Polymers and Plastics,General Chemical Engineering,Biomaterials
Reference16 articles.
1. Effect of interface fiber angle on the R-curve behavior of E-glass/epoxy DCB specimens;Shokrieh;Theor Appl Fract Mech,2016
2. Inter-laminar delamination analyses of Spar Wingskin Joints made with flat FRP composite laminates;Mishra;Int J Adhesion Adhes,2016
3. The interlaminar fracture of organic-matrix, woven reinforcement composites;Bascom;Composites,1980
4. Effect of nanomaterial on mode I and mode II interlaminar fracture toughness of woven carbon fabric reinforced polymer composites;Srivastava;Eng Fract Mech,2017
5. A new ENF test specimen for the mode II delamination toughness testing of stitched woven CFRP laminates;Wood;J Compos Mater,2007
Cited by 27 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Characterization of mode II delamination behaviour of poplar plywood and LVL;Theoretical and Applied Fracture Mechanics;2024-06
2. The over-notched flexure test method for determining the fracture toughness and bridging law of laminates;Engineering Fracture Mechanics;2024-05
3. Mode II and mode III delamination of carbon fiber/epoxy composite laminates subjected to a four-point bending mechanism;Composites Part B: Engineering;2024-02
4. Influence of curing pressure on the mode I static and fatigue delamination growth behavior of CFRP laminates;Composite Structures;2023-10
5. Maximizing the interlaminar fracture toughness of thermoset interleaved woven glass fiber laminates;Composites Part A: Applied Science and Manufacturing;2023-09
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3