Interfacial adhesion in glass-fiber thermoplastic composites processed from acrylic reactive systems, a multi-scale experimental analysis
Author:
Funder
FUI
Publisher
Elsevier BV
Subject
Polymers and Plastics,General Chemical Engineering,Biomaterials
Reference29 articles.
1. Impregnation technology for thermoplastic matrix composites;Gibson;Compos Manuf,1992
2. Reactive processing of textile fiber-reinforced thermoplastic composites - an overview;van Rijswijk;Composites, Part A,2007
3. Reaction injection pultrusion of PA12 composites: process and modelling;Luisier;Composites, Part A,2003
4. Properties of poly(butylene terephthatlate) polymerized from cyclic oligomers and its composites;Parton;Polymer,2005
5. Investigation on adhesion, interphases, and failure behaviour of cyclic butylene terephthalate (CBT®)/glass fiber composites;Mäder;Compos Sci Technol,2007
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