Application of microscale methods to study the heat-induced delamination in engineered wood products bonded with one-component polyurethane adhesives-Reference-Cited by-同舟云学术

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Application of microscale methods to study the heat-induced delamination in engineered wood products bonded with one-component polyurethane adhesives

Published:2024-09 Issue: Volume: Page:103834
ISSN:0143-7496
Container-title:International Journal of Adhesion and Adhesives
language:en
Short-container-title:International Journal of Adhesion and Adhesives

Author:

Čolić A.^ORCID,Wiesner F.^ORCID,Hopkin D.,Spearpoint M.^ORCID,Wu W.^ORCID,Bisby L.

Funder

European Cooperation in Science and Technology

Publisher

Elsevier BV

Reference65 articles.

1. P. Niemz, K. Allenspach, D. Einfluss, “Untersuchungen zum Einfluss von Temperatur und Holzfeuchte auf das Versagensverhalten von aus - gewählten Klebstoffen bei Zugscherbeanspruchung” 31 (2009) , pp.296–304. https://doi.org/10.1002/bapi.200910039.

2. Thermal stability of glued wood joints measured by shear tests;Clauß;Eur. J. Wood Wood Prod.,2011

3. Strenght and Durability of One-Part Adhesive Bonds to Wood;Vick;For. Prod. J.,1998

4. Influence of the adhesive formulation on the mechanical properties and bonding performance of polyurethane prepolymers;Clauß;Holzforschung,2011

5. Shear behaviour of bond lines in glued laminated timber beams at high temperatures;Frangi;Wood Sci. Technol.,2004

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