Comparison between microwave and thermal curing of a polyimide adhesive end-caped with phenylethynyl groups-Reference-Cited by-同舟云学术

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Comparison between microwave and thermal curing of a polyimide adhesive end-caped with phenylethynyl groups

Published:2017-04 Issue: Volume:74 Page:28-34
ISSN:0143-7496
Container-title:International Journal of Adhesion and Adhesives
language:en
Short-container-title:International Journal of Adhesion and Adhesives

Author:

Wang Kai,Yuan Xiaojie,Zhan Maosheng

Funder

Aeronautical Science Foundation of China

National Natural Science Foundation of China

Publisher

Elsevier BV

Subject

Polymers and Plastics,General Chemical Engineering,Biomaterials

Reference23 articles.

1. Evaluation of the long-term durability of high-performance polyimide adhesives for bonding titanium;Xu;J Adhes,2004

2. Polyimide-silica hybrids containing novel phenylethynyl imide silanes as coupling agents for surface-treated titanium alloy;Park;Int J Adhes Adhes,2000

3. Preparation and properties of siloxane polyimide films containing silver nanoparticles and microparticles as conducting adhesive films;Morita;J Mater Sci-Mater Electron,2001

4. Chemistry and adhesive properties of phenylethynyl-terminated phenylquinoxaline oligomers;Connell;J Adhes,1997

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