1. Development of resin stress buffer layer type wafer level chip size package with high reliability for board level test;Hashimoto;Jpn Inst Electron Packag,2008
2. Polymerization of cyclohexene oxide with Al(acac)3–silanol catalyst;Hayase;J Polym Sci: Polym Chem Ed,1981
3. Polymerization of cyclohexene oxide with aluminum complex-silanol catalysts. Part 3 dependence of catalytic activity on bulkiness of silanol and its intramolecular hydrogen bond;Hayase;J Polym Sci: Polym Chem Ed,1981
4. Polymerization of cyclohexene oxide with aluminum comlex/silanol catalysts. V. A catalytic activity dependence on the aluminum chelate structure;Hayase;J Polymer Science: Polym Chem Ed,1982
5. Polymerization of cyclohexene oxide with aluminum complex/silanol catalyst. 6. Oligomer and polymer effect;Hayase;J Polym Scie: Polym Chem Ed,1983