Effect of moisture on pure mode I and II fracture behaviour of composite bonded joints-Reference-Cited by-同舟云学术

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Effect of moisture on pure mode I and II fracture behaviour of composite bonded joints

Published:2016-07 Issue: Volume:68 Page:30-38
ISSN:0143-7496
Container-title:International Journal of Adhesion and Adhesives
language:en
Short-container-title:International Journal of Adhesion and Adhesives

Author:

Fernandes R.L.,de Moura M.F.S.F.,Moreira R.D.F.

Funder

Laboratório Associado de Energia, Transportes e Aeronáutica

Publisher

Elsevier BV

Subject

Polymers and Plastics,General Chemical Engineering,Biomaterials

Reference31 articles.

1. Predicting the residual strength for environmentally degraded adhesive lap joints;Crocombe;Int J Adhes Adhes,2006

2. Environmental degradation of the interfacial fracture energy in an adhesively bonded joint;Loh;Eng Fract Mech,2002

3. Hygroscopic behavior of woven fabric carbon–epoxy composites;Abot;J Reinf Plast Compos,2005

4. Effect of hydrothermal ageing on the thermal and delamination fracture behaviour of CFRP composites;Alessi;Composites: B,2014

5. Diffusion of water in adhesives;Comyn;Adv Struct Mater,2013

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1. Changes in the structure and physical properties of acrylic and epoxy adhesives in response to high-temperature and high-humidity environments;Results in Materials;2024-03

2. Analytical investigation of hygrothermal effects on failure mechanisms of adhesively bonded corrugated sandwich structures under three-point bending;International Journal of Adhesion and Adhesives;2024-01

3. Fracture durability of composite–titanium adhesively bonded structures exposed to seawater environment;Fatigue & Fracture of Engineering Materials & Structures;2023-09-20

4. Parametric investigation of bonded composite joints under Mode II using a new methodology based on design of experiments;The Journal of Adhesion;2023-09-13

5. Thermal cycling effects on the mode-I delamination of multilayer laminated composites: An experimental-numerical approach;Journal of Composite Materials;2023-08-03

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