Kinetic research on low-temperature cure of epoxy adhesive-Reference-Cited by-同舟云学术

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Kinetic research on low-temperature cure of epoxy adhesive

Published:2014-04 Issue: Volume:50 Page:255-264
ISSN:0143-7496
Container-title:International Journal of Adhesion and Adhesives
language:en
Short-container-title:International Journal of Adhesion and Adhesives

Author:

Xia Lanjun,Zuo Lu,Zha Shangwen,Jiang Shufang,Guan Rong,Lu Deping

Funder

Ministry of Education of the People's Republic of China

Publisher

Elsevier BV

Subject

Polymers and Plastics,General Chemical Engineering,Biomaterials

Reference61 articles.

1. Epoxy resins;Pham,2004

2. Epoxy adhesives formulations;Petrie,2006

3. Curing of DGEBA epoxy using a phenol-terminated hyperbranched curing agent: cure kinetics, gelation, and the TTT cure diagram;Li;Thermochim Acta,2012

4. Effect of poly (styrene-co-acrylonitrile) on the curing of an epoxy/amine resin;López;Polymer,2001

5. Designing of epoxy resin systems for cryogenic use;Ueki;Cryogenics,2005

Cited by 16 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Modeling of curing and post-curing kinetics for a thermoset adhesive;Thermochimica Acta;2024-06

2. EFFECT OF SURFACE TREATMENT AND CURING TEMPERATURE ON THE BOND BEHAVIOR BETWEEN STEEL MEMBER AND CARBON FIBER SHEET;Japanese Journal of JSCE;2024

3. Modeling the curing kinetics of two thermoset adhesives under varying temperature conditions;Journal of Applied Polymer Science;2023-12-27

4. Detailed analysis of nucleation and subsequent δ to γ phase transformation of a high N super austenitic stainless steel;Materials Characterization;2023-01

5. High-performance thermosets for additive manufacturing;Innovation and Emerging Technologies;2023-01

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