Transient thermal stress analysis of threaded-adhesive joints applied in non-magnetic Dewar
Author:
Publisher
Elsevier BV
Subject
Polymers and Plastics,General Chemical Engineering,Biomaterials
Reference16 articles.
1. Strength of the fiber/thermoplastic-matrix interface under cyclic cooling to low temperatures
2. Two-Dimensional Thermal Stress Analysis in Adhesive Butt Joints Containing Hole Defects and Rigid Fillers in Adhesive Under Non-Uniform Temperature Field
3. Adhesive joints at high and low temperatures using similar and dissimilar adherends and dual adhesives
4. Zhu HM, Jin TX, Xu L, Sun H, Xiao YM. Thermal Stress Analysis of Cryogenic Adhesive Joints for Non-Magnetic Dewar. In: Twentieth International Cryogenic Engineering Conference, Beijing, China, 2004.
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