Low-stress creep deformation in two opto-electronic glass-epoxy joints: Part I – adhesive creep data
Author:
Publisher
Elsevier BV
Subject
Polymers and Plastics,General Chemical Engineering,Biomaterials
Reference15 articles.
1. Thermal residual stresses in an adhesively bonded functionally graded tubular single lap joint;Apalak;Int J Adhes Adhes,2007
2. Durso SR, Howe SE, and Pressley MW. Adhesive Bond-line Read-through: Theoretical and Experimental Investigations. In: International congress and exposition, no. 724, p. SAE-1999-01-0984; 1999.
3. Fundamentals of polymeric materials;Rosen,1993
4. Use of the generalized Maxwell model for describing the stress relaxation behavior of solid-like foods;Del Nobile;J Food Eng,2007
5. Deformation behavior of an epoxy resin subject to multiaxial loadings. Part 1: experimental Investigations;Hu;Polym Eng Sci,2003
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