Shear strength of anisotropic conductive adhesive joints under hygrothermal aging and thermal cycling-Reference-Cited by-同舟云学术

Shear strength of anisotropic conductive adhesive joints under hygrothermal aging and thermal cycling

Published:2012-03 Issue: Volume:33 Page:75-79
ISSN:0143-7496
Container-title:International Journal of Adhesion and Adhesives
language:en
Short-container-title:International Journal of Adhesion and Adhesives

Author:

Gao LiLan,Chen Xu,Gao Hong

Publisher

Elsevier BV

Subject

Polymers and Plastics,General Chemical Engineering,Biomaterials

Reference29 articles.

1. Anisotropic conductive films (ACFs) for ultra-fine pitch Chip-On-Glass (COG) applications

2. Design and understanding of anisotropic conductive films (ACF's) for LCD packaging

3. Nagai A, Takemure K, Isaka K, Watanabe O, Kojima K, Matsuda K, Watanabe I Anisotropic conductive adhesive films for flip chip interconnection onto organic substrates. In: Proceedings of IEMT/IMCP, 1998. p. 353–7.

4. Water absorption effects on hydrophilic polymer matrix of carboxyl functionalized glucose resin and epoxy resin

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