Synthesis and properties of polyamide derived from piperazine and lower purity dimer acid as hot melt adhesive-Reference-Cited by-同舟云学术

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Synthesis and properties of polyamide derived from piperazine and lower purity dimer acid as hot melt adhesive

Published:2011-10 Issue:7 Volume:31 Page:735-742
ISSN:0143-7496
Container-title:International Journal of Adhesion and Adhesives
language:en
Short-container-title:International Journal of Adhesion and Adhesives

Author:

Kadam Pravin G.,Mhaske S.T.

Publisher

Elsevier BV

Subject

Polymers and Plastics,General Chemical Engineering,Biomaterials

Reference10 articles.

1. Handbook of adhesives and sealants;Petrie,2000

2. German JF, Degering EF. US patent no. 2,867,572 (1959).

3. Handbook of adhesives technology and application;Li,1991

4. Peerman DE, Vertnik LR. US patent no. 3,377,303 (1968).

5. Leoni R, Gruber W, Wichelhaus J. US patent no. 4,914,162 (1990).

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