Reduction of formaldehyde emission from medium density fiberboard using nanoclay modified with 3-aminopropyltriethoxysilane and l-Lysine as additives to urea-formaldehyde adhesive
Author:
Publisher
Elsevier BV
Subject
Polymers and Plastics,General Chemical Engineering,Biomaterials
Reference56 articles.
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3. Urea-formaldehyde adhesives;Pizzi;Handb. Adhes. Technol.,2003
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5. The influence of moisture content of raw material on the physical and mechanical properties, surface roughness, wettability, and formaldehyde emission of particleboard composite;Baharoğlu;Compos B Eng,2012
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1. Graphene oxide a promising formaldehyde scavenger of phenolic resin‐bonded plywood: From elaboration to evaluation;Journal of Applied Polymer Science;2023-12-29
2. Formaldehyde emission pattern of melamine impregnated paper decorated medium density fiberboard and its furniture products;BioResources;2023-10-30
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