1. Electronic Packaging Materials Science,1985
2. Layered Structures, Epitaxy and Interfaces,1985
3. Proc. Intern. Conf. on the Structure and Properties of Internal Interfaces,1985
4. Y. Ishida, Ed., Proc. Intern. Symp. on Interface Structure, Properties and Diffusion Bonding, to be published.
5. Proc. Intern. Conf. on Solid-Solid Phase Transformations;Cahn,1982