Effect of thermal and stress exposure on grain boundaries of silicon nitride
Author:
Publisher
Elsevier BV
Subject
Instrumentation,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference22 articles.
1. Compressive creep of Si3N4/MgO alloys
2. Compressive creep of Si3N4/MgO alloys
3. The Intergranular Phase in Hot-Pressed Silicon Nitride: I, Elemental Composition
4. Impurity Phases in Hot-Pressed Si3N4
5. High-Temperature Mechanical Properties and Microstructures for Hot-Pressed Silicon Nitrides with Amorphous and Crystalline Intergranular Phases
Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. In Situ Measurement of Bridging Stresses in Toughened Silicon Nitride Using Raman Microprobe Spectroscopy;Journal of the American Ceramic Society;2004-12-21
2. Effect of residual microstresses at crystalline multigrain junctions on the toughness of silicon nitride;Journal of the European Ceramic Society;1999-04
3. Effect of the Grain Boundary Thermal Expansion Coefficient on the Fracture Toughness in Silicon Nitride;Journal of the American Ceramic Society;1995-09
4. Internal Stresses in Silicon Nitride and Their Influence on Mechanical Behavior;Tailoring of Mechanical Properties of Si3N4 Ceramics;1994
5. Dissolution of sintered silicon nitride bulk specimens for elemental analysis;Journal of Materials Science;1992
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