SENSORS DEVELOPED FOR IN-PROCESS THERMAL SENSING AND IMAGING**This work was supported in part by the Air Force OfTice of Scientific Research under Contract No. F49620-C-0089 and by the Semiconductor Rauuch Corporation Contract No. 84-01-045.

Author:

Choi I.H.,Wise K.D.

Publisher

Elsevier

Reference6 articles.

1. “Nondestructive Determination of Thickness and Perfection of Silica Films,”;Murray;J. Electrochem. Soc.,1966

2. “Quantitative Determination of the Carrier Concentration Distribution in Semiconductors by Scanning IR Absorption: Si,”;Jastrzeske;J. Electrochem. Soc.,1979

3. “Optical Measurement of Carrier Profiles in Silicon,”;Motooka;J. Electrochem. Soc.,1984

4. “Oxygen and Carbon Measurements on Silicon Slices by the IR Method,”;Stallhofer;Solid State Technology,1983

5. “A Silicon-Thermopile-Based Infrared Sensing Array for use in Automated Manufacturing,”;Choi;IEEE Tran. Electron Devices,1986

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