Interface interactions relevant to packaging technology
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials
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2. Improved polyimide/metal adhesion by chemical modification approaches;Journal of Applied Polymer Science;2001
3. Surface modification of polymers and improvement of the adhesion between evaporated copper metal film and a polymer. I. Chemical modification of PET;Journal of Adhesion Science and Technology;2000-01
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