High capacity sputtering apparatus for hybrid microwave integrated circuits production-Reference-Cited by-同舟云学术

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High capacity sputtering apparatus for hybrid microwave integrated circuits production

Published:1974-11 Issue:1 Volume:24 Page:113-124
ISSN:0040-6090
Container-title:Thin Solid Films
language:en
Short-container-title:Thin Solid Films

Author:

Ferraris G.P.

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials

Reference11 articles.

1. Ein Produktionsverfahren zur Herstellung dünner Schichten durch Kathodenzerstaübung im Hochvakuumbereich;Gaydou;Vacuum-Technik,1966

2. The sputtering of electrical films over a large area;Sigournay,1967

3. Thin Film Technology;Berry,1968

4. Processi Tecnologici per la realizzazione di Circuiti Ibridi a Strato Sottile;Aspesi,1968

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Technological Considerations on Thin Films Process Based on NTa2;Plasma-Surface Interactions and Processing of Materials;1990

2. Thin film resistors for high precision networks;Thin Solid Films;1976-10

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