A study of thermally activated interfacial reactions in an Ni/Cr/Si multilayer structure-Reference-Cited by-同舟云学术

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A study of thermally activated interfacial reactions in an Ni/Cr/Si multilayer structure

Published:1993-05 Issue:1-2 Volume:228 Page:149-153
ISSN:0040-6090
Container-title:Thin Solid Films
language:en
Short-container-title:Thin Solid Films

Author:

Pimentel F.,Zalar A.,Hofmann S.,Kohl D.,Panjan P.

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials

Reference22 articles.

1. VLSI Technology;Sze,1988

2. Silicides for VLSI Applications;Murarka,1983

Cited by 9 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Cr-Ni-Si Ternary Phase Diagram Evaluation;MSI Eureka;2022-04-27

2. Phase equilibria of the Fe–Cr–Ni ternary systems and interfacial reactions in Fe–Cr alloys with Ni substrate;Journal of Alloys and Compounds;2008-06

3. Cr-Ni-Si (Chromium-Nickel-Silicon);Non-Ferrous Metal Systems. Part 3;2007

4. Interface reactions of an Ag/Cr/AlN sandwich during annealing between 250 and 650 °C;Thin Solid Films;1995-11

5. Neural pattern recognition applied to AES depth profiling;Surface and Interface Analysis;1995-11

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