Generation of grown-in dislocations at NiCu misfit boundaries during three-dimensional nucleation and growth
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials
Reference17 articles.
1. Struktur und Ferromagnetismus sehr dünner, epitaktischer Ni-Flächenschichten
2. Accomodation of misfit between single-crystal films of nickel and copper
3. Initial Stages of Electromonocrystallization of Nickel on Copper-Film Substrates
4. A transmission electron microscope study of electrodeposited nickel films on (001) copper substrates
5. The effect of substrate surface contamination on the electrolytic growth of epitaxial nickel films
Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Nanoindentation Simulation of Dislocation Evolution in Substrate/Film Systems;Journal of Nanoscience and Nanotechnology;2013-12-01
2. Elastic strain in a thin epitaxial “electrodeposited Ni-(001) Cu” bicrystal and misfit compensation at the interface;Physics Letters A;1991-07
3. Distribution of X-ray microdeformation caused by the dislocation compensation of misfits at the interphase boundary;Physics Letters A;1990-06
4. Influence of misfit and bonding on the mode of growth in epitaxy;Physical Review B;1989-02-15
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