Improvement of the adhesion to polyimide substrates of copper films prepared by an ion beam and vapor deposition (IVD) method-Reference-Cited by-同舟云学术

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Improvement of the adhesion to polyimide substrates of copper films prepared by an ion beam and vapor deposition (IVD) method

Published:1996-08 Issue: Volume:281-282 Page:356-359
ISSN:0040-6090
Container-title:Thin Solid Films
language:en
Short-container-title:Thin Solid Films

Author:

Ebe Akinori,Takahashi Eiji,Iwamoto Yasushi,Kuratani Naoto,Nishiyama Satoshi,Imai Osamu,Ogata Kiyoshi,Setsuhara Yuichi,Miyake Shoji

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials

Reference6 articles.

1. Adhesion enhancement of thin copper film on polyimide modified by oxygen reactive ion beam etching

2. Adhesion enhancement of Ni films on polyimide using ion processing. I. 28Si+ implantation

3. The Promotion of Metal/Polymer Adhesion by Ion Beam Enhanced Deposition

4. XPS study of the surface reaction between Au and Ar+ ion treated polyimide

Cited by 14 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effects of CO2 laser pretreatment conditions on adhesion properties of Cu/Ti films and polyimide substrates;Journal of Materials Science: Materials in Electronics;2021-05-12

2. Manipulating the triboelectric surface charge density of polymers by low-energy helium ion irradiation/implantation;Energy & Environmental Science;2020

3. Study on Aging Effect of Adhesion Strength Between Polyimide Film and Copper Layer;Metals and Materials International;2018-07-28

4. Copper cladding on polymer surfaces by ionization-assisted deposition;Japanese Journal of Applied Physics;2018-02-09

5. Damage-free polymer surface modification employing inward-type plasma;Japanese Journal of Applied Physics;2017-07-20

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