Resistance behaviour and interdiffusion of layered CuNi-NiCr films-Reference-Cited by-同舟云学术

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Resistance behaviour and interdiffusion of layered CuNi-NiCr films

Published:1995-03 Issue:1-2 Volume:258 Page:236-246
ISSN:0040-6090
Container-title:Thin Solid Films
language:en
Short-container-title:Thin Solid Films

Author:

Brückner W.,Schumann J.,Baunack S.,Pitschke W.,Knuth Th.

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials

Reference27 articles.

1. Werkstofftechnik, Vol. 1: Grundlagen;Bergmann,1989

2. Proc. 10th Tagung Hochvakuum, Grenzflächen/Dünne Schichten;Elefant,1990

3. Tagung Wer macht was in den physikalischen Technologien;Schumann;VDI-Technologiezentrum Physikalische Technologien Düsseldorf,1990

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1. The microstructure and properties of C and W co-doped NiCr embedded thin film resistors;Surface and Coatings Technology;2014-11

2. Comparison of microstructure and electrical properties of NiCr alloy thin film deposited on different substrates;Surface and Coatings Technology;2013-11

3. Annealing effect on the electrical properties and microstructure of embedded Ni–Cr thin film resistor;Journal of Alloys and Compounds;2012-10

4. Effects of Cr buffer layer thickness on the microstructure and the properties of Ni thin films deposited on polyimide substrate;Applied Surface Science;2011-12

5. Nano-sized thin films fabricated by ion beam sputtering and its properties;Journal of Wuhan University of Technology-Mater. Sci. Ed.;2007-12

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