The influence of the target material on sputter etching processes
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials
Reference7 articles.
1. Handbook of Thin Film Technology;Maissel,1970
2. RF Sputter Etching—A Universal Etch
3. X-ray measurement of elastic strain and lattice constant of diffused silicon
4. Materials of High Vacuum Technology;Espe,1966
5. Reactive sputtering of metals in oxidizing atmospheres
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1. Simulations of reactive sputtering with constant voltage power supply;Journal of Applied Physics;1998-12
2. Growth Mechanism of ZnO Film by Reactive Sputtering Method –Significance of Thermodynamics in a Plasma System–;Japanese Journal of Applied Physics;1990-05-20
3. Subtractive Etching;Semiconductor Lithography;1988
4. Microfabrication;Condensed Matter;1983
5. Deep centers introduced by argon ion bombardment in n-type silicon;Solid-State Electronics;1981-12
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