The evaluation of the technology for depositing NiCr resistive films-Reference-Cited by-同舟云学术

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The evaluation of the technology for depositing NiCr resistive films

Published:1976-08 Issue:2 Volume:36 Page:379-382
ISSN:0040-6090
Container-title:Thin Solid Films
language:en
Short-container-title:Thin Solid Films

Author:

Tavzes R.,Kansky E.,Banovec A.,Zalar A.,Gregorič M.,Barna A.,Barna P.,Pozsgai I.

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials

Reference6 articles.

1. Vacuum Deposition of Thin Films;Holland,1958

2. The development of thin film resistors and capacitors for microcircuits;Manfield;Electron. Eng.,1963

3. Properties of thin nickel-chromium films;Lakshmanan,1962

4. Evaporation, sputtering and ion-plating; pros and cons;Varga;Solid State Technol.,1973

5. Thin film miniature potentiometers;Tavzes,1975

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effect of Chromium Concentration on the Electrical Properties of NiCr Thin Films Resistor Deposited at Room Temperature by Magnetron Cosputtering Technique;Journal of The Electrochemical Society;2006

2. Effect of Deposition Temperature on the Structural and Electrical Properties of NiCr Thin-Film Resistors by Magnetron Cosputtering;Journal of The Electrochemical Society;2006

3. Substrate effect on texturized microstructures in NiCr thin films;Thin Solid Films;1992-03

4. Characterization of Ni-Cr thin films by X-ray analysis;Thin Solid Films;1987-04

5. Electrical properties and structural defects of Ni-Cr thin films;Thin Solid Films;1986-05

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