Recent trends in dry etching
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials
Reference43 articles.
1. Etching Silicon with Fluorine Gas
2. SF 6, a Preferable Etchant for Plasma Etching Silicon
3. RF Sputter-Etching by Fluoro-Chloro-Hydrocarbon Gases
4. 1-µm MOS process using anisotropic dry etching
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1. Role of Nanopowder Agglomerates in Forming the Structure and Properties of Ceramic Materials;Russian Journal of Non-Ferrous Metals;2021-03
2. Impact of High Pressures during the Compaction of Zirconia Nanopowder on Material Structure Formation;Russian Journal of Non-Ferrous Metals;2020-03
3. Interface charge trapping induced flatband voltage shift during plasma-enhanced atomic layer deposition in through silicon via;Journal of Applied Physics;2017-12-28
4. A study of metal‐oxide‐semiconductor capacitors fabricated on SF6and SF6+Cl2reactive‐ion‐etched Si;Journal of Applied Physics;1992-03-15
5. Effects of RF Bias on Remote Microwave Plasma Assisted Etching of Silicon in SF 6;Journal of The Electrochemical Society;1991-10-01
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