Chemical mechanical polishing for copper films in integrated circuit wiring layers using an advanced slurry
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Publisher
Elsevier BV
Reference63 articles.
1. Study on the film forming mechanism, corrosion inhibition effect and synergistic action of two different inhibitors on copper surface chemical mechanical polishing for GLSI;Zhou;Appl Surf Sci,2020
2. Corrosion control of copper wiring by barrier CMP slurry containing azole inhibitor: combination of simulation and experiment;Ma;Colloids Surf A,2020
3. Atomic surface of cobalt-chromium-molybdenum alloy induced by novel green chemical mechanical polishing through controlling pH values and oxidation processes;Liu;Appl Surf Sci,2024
4. Environment friendly chemical mechanical polishing of copper;Zhang;Appl Surf Sci,2019
5. Angstrom surface on copper induced by novel green chemical mechanical polishing using ceria and silica composite abrasives;Liu;Appl Surf Sci,2023
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