Author:
Stoyanov Pantcho,Gupta Shivani,Chromik Richard R.,Lince Jeffrey R.
Subject
Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanical Engineering,Mechanics of Materials
Reference41 articles.
1. On the use of alloying elements for Cu interconnect applications;Barmak;Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures,2006
2. Electronic packaging and interconnection handbook;Harper,2005
3. Interfacial microstructures and kinetics of Au/SnAgCu;Lee;Thin Solid Films,2006
4. An evaluation of gold and copper wire bonds on shear and pull testing;Murali;Journal of Electronic Packaging, Transactions of the ASME,2006
5. Solder metallization interdiffusion in microelectronic interconnects;Zribi;IEEE Transactions on Components and Packaging Technologies,2000
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