On the cracks self-healing mechanism at ductile mode cutting of silicon
Author:
Publisher
Elsevier BV
Subject
Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanical Engineering,Mechanics of Materials
Reference64 articles.
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5. A state-of-the-art review of ductile cutting of silicon wafers for semiconductor and microelectronics industries;Arif;Int J Adv Manuf Technol,2012
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