In-situ research on formation mechanisms of transfer films of a Polyimide-MoS2 composite in vacuum
Author:
Publisher
Elsevier BV
Subject
Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanical Engineering,Mechanics of Materials
Reference85 articles.
1. Roberts, Space Tribology Handbook;Emyr,2007
2. Hierarchical carbon fiber-SiO2 hybrid/ polyimide composites with enhanced thermal, mechanical, and tribological properties;Chen;Polym Compos,2018
3. Performance of high-temperature thermosetting polyimide composites modified with thermoplastic polyimide;Ke;Polym Test,2020
4. The effect of fiber oxidation on the friction and wear behaviors of short-cut carbon fiber/polyimide composites;Zhang;EXPRESS Polym Lett,2007
5. Mechanically strong and thermally insulating polyimide aerogels by homogeneity reinforcement of electrospun nanofibers;Zhao;Compos Part B,2019
Cited by 10 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Enhancing the tribological performance of polyimide composite coatings with amino-functionalized MXene nanofillers;Tribology International;2024-12
2. Improved tribological properties of W-S-C-N film contributed by the friction-induced well crystallized thick transfer layer;Tribology International;2024-10
3. Synthesis and Tribology Properties of Self-Lubricating Polyformaldehyde with Oil-Loaded Mesoporous Silica;ACS Applied Polymer Materials;2024-09-04
4. Carbon Dots with Spatially‐Mediated‐N/S‐Co‐Doping Enabling One‐Year Stable Lubricant with Oil Leakage Detection Capability;Small;2024-02-17
5. Effects of nanofillers on the wear and frictional properties of cellulosic fibre-reinforced composites under varying applied loads;FME Transactions;2024
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3