An improved interfacial bonding model for material interface modeling-Reference-Cited by-同舟云学术

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An improved interfacial bonding model for material interface modeling

Published:2017-01 Issue: Volume:169 Page:276-291
ISSN:0013-7944
Container-title:Engineering Fracture Mechanics
language:en
Short-container-title:Engineering Fracture Mechanics

Author:

Lin Liqiang,Wang Xiaodu,Zeng Xiaowei

Funder

National Institutes of Health

University of Texas at San Antonio

National Science Foundation

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Reference61 articles.

1. Toughness amplification in natural composites;Barthelat;J Mech Phys Solids,2011

2. A bridging domain method for coupling continua with molecular dynamics;Xiao;Comput Methods Appl Mech Eng,2004

3. Atomistic/continuum coupling in computational materials science;Curtin;Modell Simul Mater Sci Eng,2003

4. Quasicontinuum simulation of fracture at the atomic scale;Miller;Modell Simul Mater Sci Eng,1998

5. Numerical simulation of crack growth in an isotropic solid with randomized internal cohesive bonds;Gao;J Mech Phys Solids,1998

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