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Characterization of a fracture specimen for crack growth in epoxy due to thermal fatigue

  • Published:2005-03 Issue:5 Volume:72 Page:791-805
  • ISSN:0013-7944
  • Container-title:Engineering Fracture Mechanics
  • language:en
  • Short-container-title:Engineering Fracture Mechanics

Author:

Tang T.,Hui C.Y.,Retsos H.G.,Kramer E.J.

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Reference27 articles.

1. Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies;Lau,1996

2. Enhancement of flip-chip fatigue life by encapsulation;Suryanarayana;IEEE Trans. CHMT,1991

3. Fatigue crack propagation in an epoxy polymer;Sutton;Engng. Fract. Mech.,1974

4. Tensile, impact and fatigue behavior of an amine-cured epoxy resin;Kim;Polym. Engng. Sci.,1978

5. Fatigue of engineering plastics;Hertzberg,1980

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1. Thermal stress in silica-on-silicon disk resonators;Applied Physics Letters;2013-01-21

2. Thermal Fatigue of Cast and Hot-Pressed Lead-Antimony-Silver-Tellurium (LAST) Thermoelectric Materials;Journal of Electronic Materials;2012-10-03

3. Thermal fracture toughness measurement for underfill during temperature change;Microelectronics Reliability;2011-03

4. Underfill acceleration factor based on thermal fatigue crack growth rate;2010 Proceedings 60th Electronic Components and Technology Conference (ECTC);2010

5. Evaluation of Estimation Method for Thermal Fatigue Crack Growth Rate in Epoxy Resin Composites;TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A;2010
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